ENABLING COMPUTING AT THE SPEED OF LIGHT
We're Developing Disruptive Silicon Photonic Solutions for 100GB Data Transfer Rate and Beyond.
BUSINESS AT THE SPEED OF LIGHT - MADE IN AMERICA
VEO Photonics, A COMSoverign Company, is developing processes that will significantly advance the state-of-the-art in Silicon Photonic devices for use in advanced data interconnects, communication networks, and computing systems. Specifically, VEO Photonics' novel approach allows for overcoming the limitations of current SiP modulators, and hence can dramatically increase computing bandwidth and reduce drive power while offering lower operating costs.
VEO Photonics owns intellectual property (IP) including patents protecting its novel methods and designs. VEO’s current development efforts include independent R&D, as well as projects in conjunction with leading academic institutions.
The emerging field of Silicon Photonics (SiP) is poised to revolutionize chip-to-chip connectivity. SiP offers high-confinement and low-loss optical waveguides, replacing traditional wired lines which are impaired by electro-magnetic interference and large frequency tilt loss over long distances.
Fiber-optics enable a much larger information carrying capacity than electrical interconnects. Today fiber-optics are used to replace copper cables as the primary means of transmitting high-speed data, however there is always an acute need for a “higher” speed optical transmitter that can overcome one of the fundamental bottlenecks that limit the bandwidth of fiber-based communication.
Traditional solutions such as direct-modulated laser diodes are bandwidth limited up to 28GBaud. III-V electro-absorption modulators, the other promising approach, is indeed capable of operating at rates up to 53GBaud but with a severe penalty of higher manufacturing cost. SiP, leveraging the already established capabilities of the CMOS industry, is a promising solution towards wafer integration of optics and electronics to realize practical manufacturing costs. However, current commercial silicon modulators are limited to a rate of up to 28GBaud.
Ultra-high Rate Optical Data Center/Chip-to-Chip Interconnect
Problem: Current infrastructure is struggling to keep up with increasing demand in data rates:
Copper reaches limitations at 25Gb/s/lane at 50cm distance, but new chip-to-chip applications require lane rates in excess of 100Gb/s.
Datacenters and Metro Optical Networks: These require faster modulators that can exceed 100 Gbps on one wavelength with low cost silicon solutions. Modulators need to quadruple in speed in the next 2-3 years.
Mobile devices: Mobile device hardware designers will need to upgrade the speed of chip-to-chip connectivity from 10Gbps to beyond 100 Gbps with the rise of 5G wireless technology. In the next few years, copper lines need to be replaced with low cost integrated optical lines.
Future real-time platforms (such as VR/AR, autonomous cars): These require low latency integrated optical connectivity solutions with several 100s of Gbps speed.
All of these market applications require high speed, low-cost optical connections.
VEO Photonics' solutions significantly relieve current silicon-based modulator performance bottlenecks, increasing bandwidth and reducing electrical drive power. The performance factor of a traditional silicon modulator (by speed, power consumption, and optical loss) can increase by 4 times via advanced lithography technique. Alternatively, using a novel CMOS compatible process, the performance factor can leapfrog by up to 20 times.
PRODUCT DEVELOPMENT STRATEGY
VEO Photonics' initial product development focuses on PAM4 53GBaud operating framework. VEO’s SiP modulator can deliver superior performance with 1V CMOS drive voltage.
Following commercialization of VEO Photonics' novel technologies, Its' future product development roadmap promises to advance speed and power efficiency beyond 100GBaud.
DUSTIN H. MCINTIRE, Phd • CHIEF EXECUTIVE OFFICER
In addition to the CEO of VEO Photonics, Dr. McIntire serves as the Chief Technology Officer for its parent company COMSovereign. He is an electrical design engineer with more than 20 years of experience designing hardware and software for embedded and consumer electronics, wireless communications systems, and the Internet of Things. He has acute, broad area expertise over several emerging technology fields. His history includes successfully leading projects and teams from concept through production utilizing extensive background in computer architecture, low power circuits, embedded software, and communications protocols. Companies Dr. McIntire he has led as either a Chief Technologist, CTO, or CEO include Tranzeo Wireless, Arrayent, Prodea, and Silver-Bullet Technology. He holds a B.S. from Stanford, and M.S. and Ph.D. degrees in Electrical Engineering from UCLA.
CHEN KUO “CK” SUN, PhD • CHIEF TECHNOLOGY OFFICER
CK develops high performance optical transceivers using technologies that address current needs in the existing and upcoming billion- dollar data-com and telecom markets, as well as the exploding chip-to-chip optical interconnection market. Prior to VEO Photonics, he was the CTO of Integra R&D in charge of developing 4x25Gb laser diode driver chip, using ADP technology in optical transceiver application. Dr. Sun is highly innovative and is interested in challenging the boundaries of the technological field. He served as CTO for TiOptics and Titan Photonics in the technology development for CATV and telecom transceiver markets. He also founded and was Chief Engineer of Lightwave Solutions, which focused on a novel optical linearization technology for optical transmission. It was acquired by Cisco in 2007. He holds 21 patents in the field of high-speed photonics technology. He obtained his Ph.D. in Electrical Engineering from UCSD.
ROBERT WELSTAND, PhD • VICE PRESIDENT - ENGINEERING & FOUNDRY PROCESSES
Dr. Welstand began his engineering career at NASA’s JPL in Pasadena California and then spent 7 years doing post-doctoral research at UCSD in the field of electro-absorption modulators. Following his research, he worked at Applied Micro Circuits in modeling, design, and packaging of high-speed digital products for optical communication. He also worked at Peregrine Semiconductor in modeling, product debug, and device development of RF-SOI chips. Prior to joining VEO, Dr. Welstand worked at Qualcomm for 11 years as a Senior Staff Engineer and Principal Manager partnering with foundries and design teams to successfully launch new technology and new RFIC and RF front-end products based upon sophisticated chip architectures. He is an inventor on multiple patents. He holds a B.S. in Electrical Engineering from Caltech, and an M.S. and a Doctorate from UCSD in Electrical and Computer Engineering.
JEB BINKLEY • VICE PRESIDENT - INTEGRATED CIRCUIT DESIGN
Mr. Binkley has over 18 years of experience in high frequency IC and related systems design in the telecommunication and test and measurement markets. His employment includes engineering and director level positions at the publicly traded company MultiLink Inc., and the successful privately held company ADSANTEC Inc., which he is a founding member of. Mr. Binkley was responsible for many activities at ADSANTEC due to the company’s small startup nature. His responsibilities included fund raising through government grant proposal writing, engineering work both as an individual contributor and team lead, customer interaction, and securing and managing cutting edge custom IC design projects. He received his B.S. in Electrical Engineering (1999) from Cornell University, and his M.S. in Electrical Engineering (2004) from the University of Southern California (USC).
VEO Photonics is owned by COMSovereign Holding Corp., a Dallas based Telecom Infrastructure Company.
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Semiconductor Process Engineer
VEO Photonics, a COMSovereign Company, is seeking experienced semiconductor process engineer. Ideal candidate has wide breadth of experience and is flexible to work independently or collaboratively. Expect 30%-50% of time performing hands-on work in cleanroom. This position will be based in San Diego.
Semiconductor process integration & module development for manufacturing
Optoelectronic package mechanical design, drafting & Assembly process development
Hands-on semiconductor micro- or nano-fabrication
Semiconductor manufacturing tool operation
Package prototyping including fiber attach, die attach, and component bonding
Debug die and component level chip-package interactions
FMEA, DOE, and problem solving
Reliability testing & Stress/shock analysis
New product introduction & yield enhancement
B.S. Engineering and 10+ years relevant experience required. M.S. preferred.
Submit resumes in PDF format to firstname.lastname@example.org